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Mindspeed to Demonstrate World's First Commercially-Available Single-Chip eNodeB Solution for LTE Small Cells at 2011 Mobile World Congress

In collaboration with companies Interphase Corporation, Continuous Computing and Ixia, Mindspeed will host live LTE picocell demonstrations for service providers, customers and analysts throughout the 2011 Mobile World Congress event in its booth (2H57) and meeting room in Hall 2 of the Fira de Barcelona-Montjuic in Barcelona. The demonstrations will showcase the industry-leading features that make the Transcede-powered approach unique among semiconductor solutions marketed to manufacturers of 4G base stations.

"Mobile network operators and base station manufacturers are migrating to heterogeneous LTE networks featuring a scalable infrastructure of femtocells, picocells, microcells and macrocells," said Alan Taylor, director of marketing for the communications convergence processing business unit at Mindspeed. "This market shift will be played out over the next half decade or more with a challenging set of requirements for processing power, low-power operation, form factor flexibility, and compact configurations that can only be effectively met with a scalable SoC architecture."

Mindspeed's Transcede processor is the first fully-integrated single SoC eNodeB solution offering 3GPP Release 8-compliant LTE Layer 1, Layer 2 and Layer 3 processing with picocell performance. It offers base station manufacturers the ability to leverage the same software architecture and programming model across the company's entire family of Transcede processors, and to scale designs from femtocells and picocells to microcells and macrocells. Transcede supports multiple radio access network (RAN) technologies in a single device and provides the industry's highest level of integration. It was named "Best Mobile Technology Breakthrough" at the 2010 Mobile Excellence Awards (MEA).

About Mindspeed Technologies

Mindspeed designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes enterprise networks, broadband access networks (fixed and mobile), and metropolitan and wide area networks. We have organized our solutions for these interrelated and rapidly converging networks into three families. Our communications convergence processing (CCP) products include ultra-low-power, multi-core digital signal processor (DSP) system-on-chip (SoC) products for the fixed and mobile (3G/4G/LTE) carrier infrastructure and residential and enterprise service platforms. Our high-performance analog (HPA) products solve difficult switching, timing and synchronization challenges in next-generation optical networking, enterprise storage and broadcast video transmission applications. Our wide area networking (WAN) communications portfolio helps optimize today's circuit-switched networks. Mindspeed's products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment which serves these markets.

To learn more, please visit www.mindspeed.com. Mindspeed will also post live updates from the Mobile World Congress event at www.twitter.com/mindspeed.

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company's expectations, goals or intentions, including, but not limited to, product features and their benefits and outcomes of product demonstrations. These forward-looking statements are based on management's current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward-looking statements. These risks and uncertainties include, but are not limited to: fluctuations in our operating results and future operating losses; worldwide political and economic uncertainties and specific conditions in the markets we address; constraints in the supply of wafers and other product components from our third-party manufacturers; fluctuations in the price of our common stock; cash requirements and terms and availability of financing; loss of or diminished demand from one or more key customers or distributors; our ability to attract and retain qualified personnel; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; pricing pressures and other competitive factors; successful development and introduction of new products; lengthy sales cycles; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; the expense of and our ability to defend our intellectual property against infringement claims by others; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company's actual results to differ from those set forth in any forward-looking statement are discussed in more detail under "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations" in the company's Annual Report on Form 10-K for the year ended October 1, 2010, as well as similar disclosures in the company's subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

Editorial Contact:
Magnet PR Group
Lisa Briggs, 949-305-5131
or
Investor Relations Contact:
Mindspeed Technologies, Inc.
Andrea D. Williams, 949-579-3111
lisab@magnetprgroup.com