Published: September 06, 2010
NeoPhotonics Unveils Portfolio of Compact SFP for Bi-Directional Single Fiber Communication
SHENZHEN, China - (BUSINESS WIRE) - NeoPhotonics
today announced here at the China International Optoelectronic
Exposition (CIOE 2010) a new line of Compact
SFP (C-SFP) transceivers that combine two bi-directional Fast
Ethernet (100Mbps) or Gigabit Ethernet (1Gbps) transceivers in a single
SFP package. NeoPhotonics C-SFP's compact design and low power allow
system providers to double the port density on access line cards,
effectively doubling the number of lines that can be terminated in a
given equipment rack. These new Compact SFP transceivers enhance
NeoPhotonics' existing line of Bi-Directional modules for access
networks, which are deployed in central offices (CO) and in customer
premises equipment (CPE).
The C-SFP transceivers combine two Bi-Directional (BiDi) transceivers
into one SFP module with two LC connectors, one for each BiDi
transceiver. The pin-out is compatible with conventional SFP
transceivers and monitoring features allow early fault location to
reduce down time in system operation. The C-SFP modules support data
rates of 100Mbps for Fast Ethernet and 1Gbps for Gigabit Ethernet and
link distances of 10km to 20km. The modules are offered in commercial (0
to 70C) and industrial (-40 to +85C) temperature grades.
"Rack space in access telecommunications cabinets is at a premium as
more and more fibers must be connected to the existing infrastructure,"
said Tim Jenks, Chairman and CEO of NeoPhotonics. "Our BiDi transceiver
line already reduces the number of fibers that have to be managed, and
now our C-SFP lets our customers pack twice as many lines into the
existing rack space."
NeoPhotonics will showcase its new line of Compact SFP transceiver
modules alongside its transceiver products and passive photonic
integrated circuit (PIC) products at CIOE, in booth 522 of the
Shenzhen Convention Center, from September 6th through the 9th.
About NeoPhotonics
NeoPhotonics Corporation is a leading developer and vertically
integrated manufacturer of photonic integrated circuit (PIC) based
components, modules and subsystems for use in telecommunications
networks. Our products include active semiconductor, passive PLC and
MEMS multi-dimensional switching functions in a single product. This
integration is enabled by nano-materials and nano-scale design and
fabrication technologies. NeoPhotonics maintains headquarters in San
Jose, California and ISO 9001:2000 certified engineering and
manufacturing facilities in Silicon Valley and Shenzhen, China.
NeoPhotonics is a registered trademark and the red dot logo is a
trademark of NeoPhotonics Corporation. All other marks are the property
of their respective owners.
www.neophotonics.com
LouVan Communications Inc.
Michael Newsom, +1
508.541.9036 / mobile +1 617.803.5385
mike@louvanpr.com
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