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Palomar Technologies Exhibits New 3800 Ultra Flexible Die Bonder at SEMICON Taiwan 2010

Combining Speed, Precision and Accuracy With the Latest in Design and Mechanics

Palomar Technologies, formerly a division of Hughes Aircraft, provides solutions for microelectronic and optoelectronic packaging. Palomar's expertise is manufacturing high reliability wire bonding and die bonding machines and creating processes for complex applications. At SEMICON Taiwan, Booth #1107, Palomar Technologies and SMI Supremetec Materials, Inc. will be showcasing and demonstrating the new, fully automated 3800 Ultra Flexible Die Bonder.

Created for flexibility, high accuracy and precision, the 3800 Die Bonder is the latest in design, mechanics, software and ergonomics combined with the proven technology of Palomar's three-generation Model 3500 Die Bonder. The 3.5 micron repeatability 3 sigma and 2600 UPH over a large 907.1mm x 508mm work area enables its user to achieve high accuracy, precision and speed with flexibility in a wide variety of applications.

Common applications include eutectic die attach, laser diode packaging and high power LED packaging. Complex packages, often found in military, optoelectronic and medical devices industries, are well suited for the 3800. The 3800's high throughput, accuracy, and precision enable device manufacturers to lower costs and improve yield. An "all in one solution," the 3800 often displaces the need for additional bonders and is a valuable packaging tool for future production needs.

Palomar Microelectronics, the development, test and contract assembly division of Palomar Technologies, provides its customers turnkey complex packaging solutions. Start-ups and cash-strapped companies find Microelectronics' process development and production services an ideal solution when a capital equipment purchase is impossible. Microelectronics' experts utilize the entire Palomar Bonder toolkit, including the Model 8000 Wire Bonder / Ball (Stud) Bumper.

About Palomar Technologies

Palomar Technologies, formerly part of Hughes Aircraft, is the world's foremost provider of high-precision wire bonders, gold wire bonders, die bonders and automated component placement systems. Palomar also offers process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers in the telecommunications, medical, defense and aerospace and commercial high technology industries. Find Palomar on the web at www.palomartechnologies.com. Visit Palomar's blog at solutions.palomartechnologies.com.