Published: January 29, 2010
TriQuint Copper Flip Technology Powers World's Most Popular Devices
HILLSBORO, Ore. - (BUSINESS WIRE) - TriQuint Semiconductor, Inc. (NASDAQ: TQNT), a leading RF front-end
product manufacturer and foundry services provider, highlighted the
success of CuFlip , its patented flip chip interconnect technology,
noting shipments of 100 million units. CuFlip (pronounced Copper Flip)
enables superior RF performance and design flexibility, and speeds
manufacturing and assembly. TriQuint's highest volume CuFlip product,
the TQM7M5012, a
HADRON II PA Module , utilizes this technology to power a variety of
the world's most popular consumer devices.
Evidence of the TQM7M5012 design flexibility can be seen in the vast
array of products it supports. More than 30 customers have chosen it for
everything from data cards, netbooks and e-readers, to
Machineâto-Machine devices and many of the industry's most popular 3G
smartphones. Specifically, the TQM7M5012 is used by:
The TQM7M5012 is a 5x5mm HADRON II Polar EDGE PAM, which is 50 percent
smaller than previous generations. This highly integrated module
includes a power amplifier designed for GSM/EDGE wireless handsets and
data devices in GSM 850 / 900 / 1800 / 1900 bands. It supports both
class 12 GPRS mode and E2 open loop polar EDGE mode, while delivering
best-in-class current consumption and noise performance in the critical
GMSK mode. This significantly improves handset battery life and thermal
efficiencies.
The TQM7M5012 design flexibility is enabled in part by CuFlip ,
TriQuint's unique interconnect technique. CuFlip employs uniform copper
bumps to enhance product performance, reliability, and manufacturing
scalability. Unlike wire bonds, copper bumps enhance the thermal and
electrical conductivity, allowing a more direct signal and better
thermal path to the device without traveling through the epoxy and
back-side gold-plated vias. Additionally, CuFlip can enable very low z
height, offering a smaller overall footprint and lower height than
competitive offerings to support ultra slim device designs.
CuFlip's innate ability to mimic the streamlined assembly process of a
standard surface-mount technology (SMT) component helps reduce cycle
time and increase assembly line throughput. The uniformity of the copper
pillars ensures precise manufacturing tolerance essential for higher
parametric yields and optimal capacity utilization.
Stuart Laval, Product Marketing Manager for TriQuint Semiconductor, said
"CuFlip technology is a strategic differentiator for TriQuint. CuFlip
enables superior RF performance and design flexibility. The CuFlip
technique speeds manufacturing and assembly of the products, enabling
cost savings we are able to pass on to our customers."
TriQuint utilizes CuFlip in several forthcoming product lines including
the QUANTUM Tx Module family for Dual-Band and Quad-Band, GSM/GPRS (2G)
and GSM/GPRS/EDGE (2.5G) applications and the TRITON PA Module family
for WCDMA/HSUPA applications. Both families of products are aligned with
industry leading transceiver chipset vendors.
To learn more about TriQuint's CuFlip technology, visit our website at http://www.triquint.com/company/innovation/index.cfm.
To learn more about TriQuint's Polar EDGE PAM products, visit our
website at http://www.triquint.com/prodserv/markets/handset/index.cfm
FORWARD LOOKING STATEMENTS
This TriQuint Semiconductor, Inc. (NASDAQ: TQNT) press release
contains forward-looking statements made pursuant to the Safe Harbor
provisions of the Private Securities Litigation Reform Act of 1995.
Readers are cautioned that forward-looking statements involve risks and
uncertainties. The cautionary statements made in this press release
should be read as being applicable to all related statements wherever
they appear. Statements containing such words as 'design flexibility',
'speeds manufacturing and assembly', 'world's most popular', 'best in
class', 'precise manufacturing tolerance', 'superior RF performance', or
similar terms are considered to contain uncertainty and are
forward-looking statements. A number of factors affect TriQuint's
operating results and could cause its actual future results to differ
materially from any results indicated in this press release or in any
other forward-looking statements made by, or on behalf of, TriQuint
including, but not limited to: those associated with the
unpredictability and volatility of customer acceptance of and demand for
our products and technologies, the ability of our production facilities
and those of our vendors to meet demand, the ability of our production
facilities and those of our vendors to produce products with yields
sufficient to maintain profitability, as well as the other "Risk
Factors" set forth in TriQuint's most recent 10-Q report filed with the
Securities and Exchange Commission. This and other reports can be found
on the SEC web site, www.sec.gov.
A reader of this release should understand that these and other risks
could cause actual results to differ materially from expectations
expressed / implied in forward-looking statements.
FACTS ABOUT TRIQUINT
Founded in 1985, we "Connect the Digital World to the Global Network"
by supplying high-performance RF modules, components and foundry
services to the world's leading communications companies. Specifically,
TriQuint supplies products in the top five mobile phone manufacturers,
and is a leading gallium arsenide (GaAs) supplier to major defense and
space contractors. TriQuint creates standard and custom products using
advanced processes that include gallium arsenide, gallium nitride (GaN),
surface acoustic wave (SAW) and bulk acoustic wave (BAW) technologies to
serve diverse markets including wireless handsets, laptops, GPS/PND,
base stations, broadband communications and military. TriQuint is also
the lead researcher in a multi-year DARPA program to develop advanced
GaN amplifiers. TriQuint, as named by Strategy Analytics1, is
the number-three worldwide leader in GaAs devices and the world's
largest commercial GaAs foundry. TriQuint has ISO9001 certified
manufacturing facilities in Oregon, Texas, and Florida and a production
plant in Costa Rica; design centers are located in North America and
Germany. Visit TriQuint at www.triquint.com/rf
to receive new product information and to register for our newsletters.
1 Announced February 2009 and May 2009,
respectively.
Photos/Multimedia Gallery Available: http://www.businesswire.com/cgi-bin/mmg.cgi?eid=6160052&lang=en
TriQuint Semiconductor, Inc.
Director of Marketing, Mobile Devices
Shane
Smith, +1-503-615-9473
Mobile: +1-407-489-5291
ssmith@tqs.com
or
Product
Marketing Manager
Stuart Laval, +1-407-884-3350
Mobile:
+1-407-463-8681
slaval@tqs.com
or
Media
Contact:
Strategic MarComm Manager
Shannon Rudd,
+1-503-615-9407
srudd@tqs.com
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