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Ralink Delivers Leading Edge 802.11n Plus Bluetooth 3.0 Combo for Mobile PCs
HSINCHU, Taiwan - (BUSINESS WIRE) - Ralink Technology, a leading developer of high performance wireless
solutions, today announced availability of its RT3090BC4, an 802.11n
plus Bluetooth 3.0 Half MiniCard solution for PC OEMs. Targeting
Notebooks, Netbooks and high-volume consumer PC platforms, the RT3090BC4
delivers an unprecedented level of intelligent coexistence between Wi-Fi
and Bluetooth. With support for high-performance Bluetooth 3.0 + HS
functionality, this product catapults wireless mobile computing into a
new level of multimedia capability by enabling Bluetooth 3.0+HS and data
rates of up to 150Mbps, while maintaining the simplicity of Bluetooth
device detection and setup. With an optimized bill of material,
simplified design, and integrated manufacturing and testing procedures,
the joint solution delivers significantly lower cost and power than
discrete Wi-Fi and Bluetooth products.
The growing popularity of slim, ultra-compact mobile PCs has
sparked demand for highly-integrated, co-located wireless solutions. To
ensure optimal radio coexistence between WLAN and Bluetooth, the
RT3090BC4 combo solution incorporates a sophisticated coexistence
algorithm for improved harmony between co-located WLAN and Bluetooth
radios. It dynamically adjusts WLAN and Bluetooth transmissions to
reduce interference, and it responds automatically to the presence and
operating characteristics of nearby Wi-Fi Access Points. This results in
80 percent faster WLAN throughput compared to competing WLAN plus
Bluetooth combo devices for PCs.
The RT3090BC4 is a highly integrated solution that eliminates redundant
components required for discrete 802.11n and Bluetooth modules including
antennas, connectors, printed circuit boards, cables, and radio
shielding, delivering more than 20 percent cost savings over competing
WLAN plus Bluetooth combo products. PC OEMs also benefit from reduced
manufacturing costs through easier assembly, faster testing, and simpler
inventory control.
The RT3090BC4 supports the final 802.11n standard as well as Bluetooth
3.0 + HS, the leading-edge version of Bluetooth which was announced
earlier this year. The solution incorporates support for Motorola's
consumer-friendly user interface and 22 Bluetooth profiles including
high-performance multimedia capabilities such as stereo audio, video
streaming, and rapid digital photo transfers for personal area network
(PAN) applications.
Ralink's 802.11n technology is shipping in more than 650 products from
customers in the Americas, Europe, and Asia, and across all major Wi-Fi
market segments including personal computers, retail access points and
adapters, DSL and cable modem gateways, televisions, Blu-Ray players,
web cameras, digital photo frames, and IPTV set-top-boxes. Dozens of
customers across these segments ship WLAN products using Ralink's
innovative, high-performance Wi-Fi CERTIFIED 802.11n chipsets. "Ralink'
Wi-Fi solutions are featured in millions of desktop and portable PCs
worldwide, as well as the entire ecosystem of WLAN products including
retail networking devices," said Dr. Horen Chen, President of Ralink
Technology, "The RT3090BC4 WLAN/Bluetooth combo solution enables
manufacturers to quickly move into the new Bluetooth 3.0 + HS era and
increase revenues."
MSI is among the first PC OEMs to adopt Ralink's 802.11n plus Bluetooth
combo solution. "We are pleased to expand our partnership with Ralink
into the fast growing mobile PC market," said Jean Huang, Senior VP of
MSI. "With its advanced R&D and early investment in the 'next
generation' of Bluetooth/Wi-Fi co-location technology, Ralink is far
ahead of its competition with this first-shipping High Speed Bluetooth +
802.11n module for PCs. Once again Raink has demonstrated that it is at
the forefront of the PC wireless components market, with high
performance, reliable, and cost-effective Wi-Fi technology," Huang added.
About Ralink Technology
Ralink Technology Corporation is a leading innovator and developer of
wireless chipset solutions. Ralink products are recognized for the
superior throughput, extended range, low-power consumption and
consistent reliability required for Wi-Fi, mobile and embedded
applications. These feature-rich chipsets have a high level of chip
integration, enabling customers to build smaller and more sophisticated
mobile wireless products cost-effectively. Ralink's patented MIMObility
technology extends Wi-Fi applications from traditional PC networking to
a range of digital multimedia and handheld devices including cell
phones, PDAs, cameras, print servers, HDTV and video game players.
Ralink customers can look forward to continuous improvements in speed,
bandwidth and reliability with IEEE 802.11n solutions for
next-generation high-performance Wi-Fi. Ralink Technology was founded in
2001 with headquarters in Hsin-chu, Taiwan and an R&D center in
Cupertino, California. For more information, visit Ralink at www.ralinktech.com.
Ralink, Ralink Technology and MIMObilityTM are Ralink's
registered trademarks; All other trademarks mentioned in this document
are the property of their respective owners.
Ralink Technology
Max Hsu, +886-3-560868 ext 1607
max_hsu@ralinktech.com.tw
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