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Wafer Level Chip Scale Packaging Forum Present at ESTC in Greenwich, UK

WLCSP Forum Objectives

The WLCSP Forum's objectives are to promote the adoption of semiconductor devices using Wafer Level Chip Scale Packages, and to establish industry sponsored "best practices" for their utilization and strategies for migration to finer pitch WLCSP products. Members include industry leaders such as Amkor, Analog Devices, California Micro Devices, Cypress, Fairchild, FlipChip, GEM, Infineon, LORD, Maxim, National, Nokia, NXP, Pac Tech, STMicroelectronics, Umicore and Volterra.

WLCSP Forum Benefits

Benefits include: access to the Members' only section of the website to download Forum research, papers and application notes, access to the Forum "blog" to network with other Members and reach the whole CSP "ecosystem", regular Forum meetings, participation in working groups and surveys and an unlimited number of your company colleagues with full access to Forum benefits. Go to: http://www.wlcspforum.org/join_wlcsp.aspx.

Upcoming Events

The WLCSP Forum will be presenting papers, and will have a booth presence at the IWLCP Conference inSan Jose, California, on October 15-16, 2008, organized by the SMTA. The WLCSP Forum will also organize a general meeting during this event.

About the WLCSP Forum

The Wafer Level Chip Scale Packaging Forum is aCalifornia, non-profit, mutual benefit corporation focused on promoting the adoption of WLCSP semiconductor devices. Detailed information may be accessed at http://www.wlcspforum.org.

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SOURCE Wafer Level Chip Scale Packaging