Published:
STMicroelectronics First to Combine Handset Audio Filtering and ESD Protection
GENEVA, July 1 /PRNewswire-FirstCall/ -- For superior audio performance in
feature-rich cellphones, the EMIF06-AUD01F2 from STMicroelectronics (NYSE:
STM), the world's leading supplier of integrated passive and active devices,
implements the complete EMI (electromagnetic interference) filtering and ESD
(electrostatic discharge) protection for stereo headset output and external
and internal microphones within a flip-chip package measuring 2.42 x 1.92mm.
The EMIF06-AUD01F2 eliminates audible handset demodulation noise, or
'bumble-bee' noise, by achieving -25dB attenuation (S21) throughout the stop-
band 800-2480MHz using high-density 1.3nF PZT (lead, zirconate titanate)
capacitors on the microphone lines. The device also achieves high ESD
protection through the combination of integrated TVS (transient voltage
suppressor) diodes, low-inductance packaging, and the Z-R-Z pi-filter
topology.
As the first device to combine filtering and ESD protection for all
handset speaker and microphone channels, the EMIF06-AUD01F2 saves more than
50% of board space compared to previous integrated solutions using two ICs
with external resistors, and up to 77% compared to alternative discrete
solutions. All necessary biasing circuitry is also integrated, as well as a
10-Ohm series resistor in the speaker output, thereby minimizing external
components. The low package profile of 0.65mm also helps designers implement
high functionality within cutting-edge, ultra-slim handset styles.
The space-saving advantages are combined with better audio performance and
higher ESD protection compared to integrated or discrete alternatives. The
integrated TVS diodes have a 20V peak clamping voltage, enabling the device to
meet IEC61000-4-2 level 4 ESD protection at the external pins. Total harmonic
distortion (THD) is less than -75dB, while the device achieves high audio-
power transfer by delivering 135mA per speaker channel ensuring excellent
sound reproduction. This is achieved thanks to the high thermal efficiency of
the wafer-level flip-chip package, which supports 285mW total continuous power
dissipation.
The EMIF06-AUD01F2 is already in volume production, and is available at
$0.55 for 1000 pieces.
About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering
semiconductor solutions across the spectrum of microelectronics applications.
An unrivalled combination of silicon and system expertise, manufacturing
strength, Intellectual Property (IP) portfolio and strategic partners
positions the Company at the forefront of System-on-Chip (SoC) technology and
its products play a key role in enabling today's convergence markets. The
Company's shares are traded on the New York Stock Exchange, on Euronext Paris
and on the Milan Stock Exchange. In 2007, the Company's net revenues were $10
billion. Further information on ST can be found at www.st.com.
SOURCE STMicroelectronics
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