Published:
Novellus Sets New Benchmark in Tungsten Productivity
SAN JOSE, Calif., July 1 /PRNewswire-FirstCall/ -- Novellus Systems today
announced the introduction of ALTUS(R) Max(TM), the latest enhancement to its
industry-leading pulsed nucleation layer (PNL(TM)) tungsten deposition
platform. Targeting high-volume memory megafabs, ALTUS Max delivers the
industry's highest level of productivity for tungsten contact fill and
interconnect applications with the platform's benchmark reliability. The
system incorporates the latest technology and advanced processing capability
to provide tungsten films that meet or exceed 20nm memory requirements for
fill, resistivity, roughness and defects.
(Photo: http://www.newscom.com/cgi-bin/prnh/20080701/AQTU513)
"The new memory megafabs coming online are looking for specialized value
in the form of high productivity and reduced cost of ownership along with
leading-edge technology," said Aaron Fellis, ALTUS product general manager at
Novellus. "ALTUS Max fulfills this need in tungsten deposition with
significant savings in fab space due to the decrease in total system
footprint. It is the first atomic layer deposition tungsten system to break
the 120WPH throughput barrier, while providing world-class reliability and
single-digit defect performance. The multi-station architecture also enables
the latest in nucleation technology, PNLxT, to offer both exceptional fill and
the lowest possible tungsten resistivity."
ALTUS Max combines advanced technology with Novellus' production-proven
multi-station sequential deposition architecture to provide a 50 percent
higher throughput than competing products. The system employs SwiftTrak(TM)
wafer handling for improved throughput and reliability. In addition, the new
ALTUS Max Multi-Thickness Recipe management system, in which wafers of
different film thicknesses can be processed simultaneously within the same
chamber, further improves the system efficiency, resulting in higher
throughput.
ALTUS Max also features the latest advanced deposition technology. The
latest process technology innovation, PNLxT(TM), provides lower contact
resistance and enables tungsten fill of aggressive, high-aspect-ratio features
at the 20nm node. The new chamber clean technology provides a fundamental
improvement in particle performance, achieving single-digit defects at 65nm
particle size.
Currently in production qualification with a large memory manufacturer in
Asia, ALTUS Max will be available for volume shipment beginning in Q4 of 2008.
About ALTUS:
Introduced in 1991, ALTUS is the industry's tool of choice for tungsten
deposition. The system provides leading productivity and technology for
contact and local interconnect applications. Its pulsed nucleation layer
integrates a high-throughput atomic layer deposition (ALD) nucleation layer
with chemical vapor deposition (CVD bulk deposition). Novellus' Multi-Station
Sequential Deposition (MSSD) architecture enables the nucleation layer and CVD
fill to be performed within the same ALTUS chamber. The integrated PNL and CVD
approach produces benchmark productivity and superior production availability,
resulting in the lowest-cost-of-ownership tungsten deposition solution in the
industry.
About Novellus:
Novellus Systems, Inc. (Nasdaq: NVLS) is a leading provider of advanced
process equipment for the global semiconductor industry. The company's
products deliver value to customers by providing innovative technology backed
by trusted productivity. An S&P 500 company, Novellus is headquartered inSan
Jose, Calif. with subsidiary offices across the globe. For more information,
please visit http://www.novellus.com.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act
of 1995
This press release contains forward-looking statements within the meaning
of Section 27A of the Securities Act of 1933, as amended, and Section 21E of
the Securities Exchange Act of 1934, as amended, including statements
regarding (i) our beliefs regarding the productivity, performance and
incorporation of advanced technology of and into the ALTUS Max, (ii) our
belief that new memory megafabs coming online are looking for specialized
value in the form of high productivity and reduced cost ownership along with
leading edge technology, (iii) our expectation that ALTUS Max will be
available for volume shipment beginning in Q4 of 2008 and (iv) other matters
discussed in this press release that are not purely historical, all of which
are forward-looking statements. Forward-looking statements involve risks and
uncertainties that may cause actual results to differ materially from those
contemplated by such statements. These risks and uncertainties include, but
are not limited to, changes in the focus of new memory megafabs coming online,
delays and difficulties in the manufacturing and distribution process and
other risks indicated in our filings with the Securities and Exchange
Commission, including our Annual Report on Form 10-K for the year ended
December 31, 2007, our Quarterly Report on Form 10-Q for the quarter ended
March 29, 2008, and our Current Reports on Form 8-K and amendments to such
reports. Forward-looking statements are made and based on information
available to us on the date of this press release. We do not assume, and
expressly disclaim, any obligation to update this information.
ALTUS is a registered trademark and Max, PNL, SwiftTrak and PNLxT are
trademarks of Novellus Systems, Inc.
SOURCE Novellus Systems, Inc.
Copyright © 2009, PRNewswire
Copyright © 2009, NewsBlaze,
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