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STATS ChipPAC to Host Financial Analysts and Investors Forum on May 18, 2006

SINGAPORE -- 04/19/06 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ: STTS) and (SGX-ST: STATSChP), a leading independent semiconductor test and advanced packaging service provider, today announced it would host a Financial Analysts and Investors Forum on May 18, 2006 at the company's Singapore headquarters. The forum will provide the opportunity to learn more about STATS ChipPAC's growth strategy, technology direction and market positioning.

Attendees will have the opportunity to ask questions of the Company's senior executives. The forum will be webcast for interested persons unable to attend the live sessions.

The Financial Analysts and Investors Forum will begin at 9a.m. on Thursday, May 18, 2006 and will conclude with a plant tour.

Date        Thursday, May 18 2006

Venue       STATS ChipPAC Ltd.
            10 Ang Mo Kio Street 65, Techpoint #05-17/20, Singapore 569059
            STATS ChipPAC Ltd. (Plant Tour)
            5 Yishun Street 23 Singapore  768442
            The event will be webcast.

Presenters  Tan Lay Koon - President and Chief Executive Officer
            Michael G. Potter - Chief Financial Officer
            Scott J. Jewler - Chief Strategy Officer
            Dr. Han Byung Joon - Chief Technology Officer
            Cindy Palar - Vice President, Product Line Management-Assembly
            Michael Shraeder - Senior Director,
                                  Product Line Management-Test

To register for STATS ChipPAC's Investor and Financial Analyst Forum, please contact:

Lee Ching Ching                          The Ruth Group
Senior Investor Relations Manager        David Pasquale
Tel: (65) 6824 7705                      Executive Vice President
Fax: (65) 6720 7826                      Tel: (646) 536 7006
email: chingching.lee@statschippac.com   email: dpasquale@theruthgroup.com

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ: STTS) and (SGX-ST: STATSChP) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated, multi-site, end-to-end packaging and testing solutions that bring products to the market faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs) and fabless companies in the United States, Europe and Asia. STATS ChipPAC is a leader in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications including communications, power, digital consumer and computing. With advanced process technology capabilities and a global manufacturing presence spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC has a reputation for providing dependable, high quality test and packaging solutions. The Company's customer support offices are centered in the United States (California's Silicon Valley, Arizona, Texas, Massachusetts, Colorado and North Carolina). Our offices outside the United States are located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the Netherlands and United Kingdom. STATS ChipPAC's facilities include those of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District, Taiwan. These facilities offer new product introduction support, pre-production wafer sort, final test, packaging and other high volume preparatory services. Together with our research and development centers in South Korea, Singapore, Malaysia, China, Taiwan and the United States as well as test facilities in the United States, this forms a global network providing dedicated test engineering development and product engineering support for customers from design to volume production. STATS ChipPAC is listed on both the Nasdaq National Market and the Singapore Exchange Securities Trading Limited. In addition, STATS ChipPAC is also included in the Morgan Stanley Capital International (MSCI) Index and the Straits Times Industrial Index. Further information is available at . Information contained in this website does not constitute a part of this release.

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